Inventor · disambiguated record
Burhan Ozmat
Also filed as: OZMAT BURHAN
13 granted patents·1 pending application·1,523 citations·filing 1986–2001
95Inventor score
Top patents by PatentIndex Score
14 records- 0198US4811082AHigh performance integrated circuit packaging structureIBM·Filed 1986·Granted Mar 7, 1989·649 cites·25 claims
- 0297US6377461B1Power electronic module packagingGEN ELECTRIC·Filed 2000·Granted Apr 23, 2002·139 cites·15 claims
- 0396US4817093AMethod of partitioning, testing and diagnosing a VLSI multichip package and associated structureIBM·Filed 1987·Granted Mar 28, 1989·153 cites·28 claims
- 0495US4866507AModule for packaging semiconductor integrated circuit chips on a base substrateIBM·Filed 1986·Granted Sep 12, 1989·148 cites·37 claims
- 0593US6196307B1High performance heat exchanger and methodINTERSIL INC·Filed 1998·Granted Mar 6, 2001·139 cites·32 claims
- 0689US6397450B1Method of cooling an electronic power module using a high performance heat exchanger incorporating metal foam thereinINTERSIL INC·Filed 2000·Granted Jun 4, 2002·52 cites·45 claims
- 0786US6232151B1Power electronic module packagingGEN ELECTRIC·Filed 1999·Granted May 15, 2001·73 cites·16 claims
- 0885US5402004AHeat transfer module for ultra high density and silicon on silicon packaging applicationsTEXAS INSTRUMENTS INC·Filed 1993·Granted Mar 28, 1995·83 cites·10 claims
- 0974US4943468ACeramic based substrate for electronic circuit system modulesTEXAS INSTRUMENTS INC·Filed 1988·Granted Jul 24, 1990·30 cites·23 claims
- 1060US5195021AConstraining core for surface mount technologyTEXAS INSTRUMENTS INC·Filed 1991·Granted Mar 16, 1993·31 cites·37 claims
- 1148US5754403AConstraining core for surface mount technologyTEXAS INSTRUMENTS INC·Filed 1994·Granted May 19, 1998·17 cites·29 claims
- 1241US5756368AIntegrated circuit packaging method and the packageTEXAS INSTRUMENTS INC·Filed 1996·Granted May 26, 1998·8 cites·16 claims
- 1333US2001026840A1Method of metalizing a semiconductor power device ceramic memberFiled 2001·Application pending·0 cites
- 1431US6476470B1Integrated circuit packagingTEXAS INSTRUMENTS INC·Filed 1995·Granted Nov 5, 2002·1 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →