Inventor · disambiguated record
Bum Wook Park
Also filed as: PARK BUM-WOOK
2 granted patents·1 pending application·9 citations·filing 2000–2017
51Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0180US10032738B2Method for forming bump of semiconductor packageSMART MODULAR TECH LX S A R L·Filed 2017·Granted Jul 24, 2018·8 cites·13 claims
- 0246US7956450B2Multi-chip packageSMART MODULAR TECHNOLOGIES·Filed 2009·Granted Jun 7, 2011·1 cites·11 claims
- 0329US2001007084A1Automatic wire bonder and method for implementing thereofFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →