Inventor · disambiguated record
Byeong-Yeon Cho
Also filed as: CHO BYEONG-YEON
10 granted patents·3 pending applications·43 citations·filing 2005–2024
86Inventor score
Top patents by PatentIndex Score
13 records- 0192US10546844B2Stack package and method of manufacturing the stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 28, 2020·15 cites·16 claims
- 0284US9665122B2Semiconductor device having markings and package on package including the sameKWON HEUNG KYU·Filed 2015·Granted May 30, 2017·6 cites·20 claims
- 0383US2024321842A1Package-on-package (pop) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0481US8618671B2Semiconductor packages having passive elements mounted thereontoKWON HEUNG-KYU·Filed 2010·Granted Dec 31, 2013·6 cites·11 claims
- 0579US12033991B2Package-on-package (PoP) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 0678US7374969B2Semiconductor package with conductive molding compound and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 20, 2008·9 cites·39 claims
- 0776US8253228B2Package on package structureKIM YONG-HOON·Filed 2011·Granted Aug 28, 2012·4 cites·20 claims
- 0870US10971484B2Package-on-package (PoP) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 6, 2021·0 cites·20 claims
- 0968US11552062B2Package-on-package (PoP) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·19 claims
- 1066US7928435B2Interposer chip and multi-chip package having the interposer chipSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 19, 2011·3 cites·22 claims
- 1159US10692846B2Package-on-package (PoP) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·19 claims
- 1250US2013256916A1Semiconductor packages and methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1348US2017012025A1Semiconductor packages and methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →