Inventor · disambiguated record
Byung Ju Choi
Also filed as: CHOI BYUNG-JU
16 granted patents·2 pending applications·12 citations·filing 2003–2023
87Inventor score
Top patents by PatentIndex Score
18 records- 0184US9416243B2Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resistLG CHEMICAL LTD·Filed 2014·Granted Aug 16, 2016·3 cites·22 claims
- 0281US9134609B2Photo-curable and thermo-curable resin compostion, and dry film solder resistLG CHEMICAL LTD·Filed 2014·Granted Sep 15, 2015·2 cites·25 claims
- 0374US8349538B2Photo-curable and thermo-curable resin composition, and a dry film solder resistLG CHEMICAL LTD·Filed 2011·Granted Jan 8, 2013·2 cites·2 claims
- 0468US12448490B2Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the sameLG CHEMICAL LTD·Filed 2023·Granted Oct 21, 2025·0 cites·4 claims
- 0567US8334092B2Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical propertyCHOI BO-YUN·Filed 2011·Granted Dec 18, 2012·2 cites·17 claims
- 0663US9880467B2Photo-curable and thermo-curable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2013·Granted Jan 30, 2018·1 cites·16 claims
- 0761US11515245B2Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the sameLG CHEMICAL LTD·Filed 2018·Granted Nov 29, 2022·0 cites·14 claims
- 0861US9389504B2Photo-curable and thermo-curable resin composition, and dry film solder resistLG CHEMICAL LTD·Filed 2013·Granted Jul 12, 2016·0 cites·18 claims
- 0955US2025101217A1Resin composition and printed circuit board comprising sameLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 1051US11702520B2Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the sameLG CHEMICAL LTD·Filed 2019·Granted Jul 18, 2023·0 cites·6 claims
- 1151US10795259B2Photo-curable and heat-curable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2017·Granted Oct 6, 2020·0 cites·20 claims
- 1248US9778566B2Photocurable and thermocurable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2015·Granted Oct 3, 2017·0 cites·23 claims
- 1346US9788434B2Preparation method for dry film solder resist and film laminate used thereinLG CHEMICAL LTD·Filed 2014·Granted Oct 10, 2017·0 cites·16 claims
- 1444US11361878B2Method for manufacturing insulating film and semiconductor packageLG CHEMICAL LTD·Filed 2018·Granted Jun 14, 2022·0 cites·17 claims
- 1543US11879075B2Resin composition for bonding semiconductors, adhesive film for semiconductor using the same, dicing die bonding film, and method for dicing semiconductor waferLG CHEMICAL LTD·Filed 2019·Granted Jan 23, 2024·0 cites·16 claims
- 1643US7527690B2Ferroelectric ceramic compound, a ferroelectric ceramic single crystal, and preparation processes thereofIBULE PHOTONICS CO LTD·Filed 2003·Granted May 5, 2009·2 cites·7 claims
- 1732US2012070780A1Photosensitive resin composition, dry film solder resist, and circuit boardCHOI BO-YUN·Filed 2011·Application pending·0 cites
- 1831US9865480B2Printed circuit board including under-fill dam and fabrication method thereofCHOI BYUNG-JU·Filed 2011·Granted Jan 9, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →