Inventor · disambiguated record
Byungkeun Hwang
Also filed as: HWANG BYUNGKEUN
0 granted patents·12 pending applications·0 citations·filing 2022–2025
Files withSAMSUNG ELECTRONICS CO LTD12
Top patents by PatentIndex Score
12 records- 0161US2025163569A1Area-selective film forming method using polyureaSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0259US2025163081A1Silicon compounds and methods of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0358US2025305120A1Method for selective deposition of layer of interestSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0457US2022380390A1Silicon compounds and methods of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0555US2024243010A1Inhibitor for selectively depositing thin film and method for selectively depositing thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0655US2024429039A1Method of depositing filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0753US2023369039A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0849US2023406822A1Silicon compound and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0948US2024145303A1Selective thin film formation method and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1048US2023215723A1Methods of manufacturing integrated circuit devices using carbonyl compoundsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1148US2024213017A1Method of manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1247US2023407051A1Process of forming silicon-containing film and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →