Inventor · disambiguated record
Byoungkon Jo
Also filed as: JO BYOUNGKON
2 granted patents·10 pending applications·0 citations·filing 2023–2025
25Inventor score
Files withSAMSUNG ELECTRONICS CO LTD12
Top patents by PatentIndex Score
12 records- 0172US2025342872A1Semiconductor memory device and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0257US12380935B2Semiconductor memory device and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·18 claims
- 0357US2025120099A1Memory device and a memory system including the memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0456US12265488B2Apparatus and method for die-to-die (D2D) interconnectsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 0554US2024387495A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0654US2024347524A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0754US2024427715A1Optical memory module and optical computing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0852US2025013366A1Memory device including content addressable memory and method of inputting and outputting data thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0952US2025062303A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1050US2024371831A1Semiconductor apparatus using both surfaces of a wafer and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1149US2025329367A1Memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1246US2025372580A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →