Inventor · disambiguated record
Byung Hyun Jung
Also filed as: JUNG BYUNG H · JUNG BYUNG-HYUN
7 granted patents·2 pending applications·40 citations·filing 1999–2005
83Inventor score
Top patents by PatentIndex Score
9 records- 0159US6911382B2Method of forming a contact in a semiconductor device utilizing a plasma treatmentDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Jun 28, 2005·8 cites·17 claims
- 0257US7022601B2Method of manufacturing a semiconductor deviceDONGBUANAM SEMICONDUCTOR INC·Filed 2003·Granted Apr 4, 2006·7 cites·14 claims
- 0354US7259092B2Semiconductor device and method for fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Aug 21, 2007·5 cites·20 claims
- 0451US6800553B2Method for manufacturing a silicide layer of semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2002·Granted Oct 5, 2004·4 cites·19 claims
- 0549US6916737B2Methods of manufacturing a semiconductor deviceDONGBUANAM SEMICONDUCTOR INC·Filed 2003·Granted Jul 12, 2005·5 cites·7 claims
- 0644US7148139B2Method for forming metal wiring of semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Dec 12, 2006·2 cites·15 claims
- 0743US2005186787A1Semiconductor devices and methods to form a contact in a semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 0836US2005140012A1Method for forming copper wiring of semiconductor deviceDONGBUANAM SEMICONDUCTOR INC·Filed 2004·Application pending·0 cites
- 0932US6319825B1Metallization process of semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 1999·Granted Nov 20, 2001·9 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →