Inventor · disambiguated record
Byoung Young Kang
Also filed as: KANG BYOUNG H · KANG BYOUNG YOUNG
7 granted patents·1 pending application·104 citations·filing 2003–2008
86Inventor score
Top patents by PatentIndex Score
8 records- 0185US7372122B2Image sensor chip package and method of fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2005·Granted May 13, 2008·14 cites·17 claims
- 0285US7119001B2Semiconductor chip packages and methods for fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Oct 10, 2006·46 cites·12 claims
- 0383US7701044B2Chip package for image sensor and method of manufacturing the sameSAMSUNG TECHWIN CO LTD·Filed 2007·Granted Apr 20, 2010·14 cites·22 claims
- 0479US7510902B2Image sensor chip package and method of fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2008·Granted Mar 31, 2009·8 cites·13 claims
- 0563US6836961B2Ceramic packaging method employing flip-chip bondingDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Jan 4, 2005·12 cites·7 claims
- 0655US7229849B2Method for packaging a semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Jun 12, 2007·7 cites·20 claims
- 0747US6953710B2Method for packaging a semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Oct 11, 2005·3 cites·2 claims
- 0833US2007072330A1Wafer bonding compatible with bulk micro-machiningRENSSELAER POLYTECH INST·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →