Inventor · disambiguated record
Byoung-Un Kang
Also filed as: KANG BYOUNG-UN
6 granted patents·7 pending applications·16 citations·filing 2002–2008
76Inventor score
Top patents by PatentIndex Score
13 records- 0179US7485494B2Dicing die adhesive film for semiconductorLS CABLE LTD·Filed 2006·Granted Feb 3, 2009·5 cites·12 claims
- 0269US7408015B2Reacting functionalized trialkoxysilane with polyepoxide or diamine to yield silane adductLG CABLE LTD·Filed 2005·Granted Aug 5, 2008·5 cites·9 claims
- 0367US7768141B2Dicing die attachment film and method for packaging semiconductor using sameLG INNOTEK CO LTD·Filed 2007·Granted Aug 3, 2010·4 cites·14 claims
- 0458US2009088527A1Attach paste composition for semiconductor packageLS MTRON LTD·Filed 2008·Application pending·0 cites
- 0556US7105625B2Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the sameLG CABLE LTD·Filed 2003·Granted Sep 12, 2006·2 cites·4 claims
- 0645US7553701B2Semiconductor packaging methodLS MITRON LTD·Filed 2008·Granted Jun 30, 2009·0 cites·4 claims
- 0744US6878261B2Surface treatment method of copper foil with silane coupling agentLG CABLE LTD·Filed 2002·Granted Apr 12, 2005·0 cites·6 claims
- 0840US2007134847A1Die-attaching paste composition and method for hardening the sameKANG BYOUNG-UN·Filed 2006·Application pending·0 cites
- 0940US2005266249A1Flexible metal clad laminate film and a manufacturing method for the sameSHIN DONGCHEON·Filed 2004·Application pending·0 cites
- 1039US2010317155A1Multifunctional die attachment film and semiconductor packaging using the sameKANG BYOUNG-UN·Filed 2007·Application pending·0 cites
- 1136US2010087067A1Method for packaging semiconductorSEO JOON-MO·Filed 2007·Application pending·0 cites
- 1235US2009198013A1Adhesive film for semiconductorSHIN DONG-CHEON·Filed 2005·Application pending·0 cites
- 1334US2007101877A1Dual printing mask for screen printingSEO JOON-MO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →