Inventor · disambiguated record
Byung Hak Kang
Also filed as: KANG BYUNG HAK · KANG BYUNG W
7 granted patents·4 pending applications·124 citations·filing 2006–2024
86Inventor score
Top patents by PatentIndex Score
11 records- 0197USD974975SFront bumper cover for automobileHYUNDAI MOTOR CO LTD·Filed 2022·Granted Jan 10, 2023·53 cites·1 claims
- 0294USD984331SRadiator grille for automobileHYUNDAI MOTOR CO LTD·Filed 2022·Granted Apr 25, 2023·24 cites·1 claims
- 0387USD809440SAutomobile front bumperHYUNDAI MOTOR CO LTD·Filed 2016·Granted Feb 6, 2018·30 cites·1 claims
- 0479USD1042262SCar rear bumper upper coverHYUNDAI MOTOR CO LTD·Filed 2023·Granted Sep 17, 2024·6 cites·1 claims
- 0567USD1061360SCar rear bumper lower coverHYUNDAI MOTOR CO LTD·Filed 2023·Granted Feb 11, 2025·3 cites·1 claims
- 0660US2025126715A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0759USD871983SFront bumper cover for vehiclesHYUNDAI MOTOR CO LTD·Filed 2018·Granted Jan 7, 2020·7 cites·1 claims
- 0853US2015049445A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0947US2016212856A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1040US2007029895A1Structure capable of automatically locating and supporting nodal point of a piezoelectric statorSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1134USD833929SBumper for vehiclesHYUNDAI MOTOR CO LTD·Filed 2017·Granted Nov 20, 2018·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →