Inventor · disambiguated record
Byeong-Jun Kim
Also filed as: KIM BYEONG-JUN
19 granted patents·3 pending applications·197 citations·filing 1995–2023
94Inventor score
Top patents by PatentIndex Score
22 records- 0190US6485815B1Multi-layered dielectric layer including insulating layer having Si-CH3 bond therein and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Nov 26, 2002·35 cites·9 claims
- 0289US10425718B2Electronic device, storage medium, and method of processing audio signal by electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 24, 2019·9 cites·26 claims
- 0382US10178485B2Method for detecting wrong positioning of earphone, and electronic device and storage medium thereforSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·3 cites·18 claims
- 0471US9894027B2Electronic device and method for controlling notification setting of messageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 13, 2018·2 cites·16 claims
- 0571US5973305AMicrowave oven door having a microwave shielding structureDAEWOO ELECTRONICS CO LTD·Filed 1995·Granted Oct 26, 1999·40 cites·14 claims
- 0669US10939218B2Method for detecting wrong positioning of earphone, and electronic device and storage medium thereforSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 2, 2021·1 cites·16 claims
- 0769US5747781AMicrowave oven with turntable and swingable electrical heaterDAEWOO ELECTRONICS CO LTD·Filed 1996·Granted May 5, 1998·36 cites·3 claims
- 0867US9812168B2Electronic device and method for playing back image dataSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·1 cites·18 claims
- 0967US6355554B1Methods of forming filled interconnections in microelectronic devicesSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Mar 12, 2002·15 cites·32 claims
- 1067US6294315B2Method of forming a metal wiring by a dual damascene process using a photosensitive polymerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 25, 2001·13 cites·11 claims
- 1154US6218079B1Method for metalization by dual damascene process using photosensitive polymerSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Apr 17, 2001·17 cites·12 claims
- 1253US2025093753A1System for providing photography service and operation method thereofSEOBUK CO LTD·Filed 2023·Application pending·0 cites
- 1349US10387101B2Electronic device for providing content and control method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 20, 2019·0 cites·18 claims
- 1447US2010030152A1Multi Injection Microneedle Therapy SystemMCURE CO LTD·Filed 2008·Application pending·0 cites
- 1544US5834847ACompletely buried contact holesSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 10, 1998·9 cites·22 claims
- 1641US6777322B2Method for fabricating a multi-layered dielectric layer including insulating layer having Si-CH3 bond thereinSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 17, 2004·0 cites·9 claims
- 1741US2014129215A1Electronic device and method for estimating quality of speech signalSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1840US6054699AFront panel assembly for microwave oven and method for assembling the sameDAEWOO ELECTRONICS CO LTD·Filed 1998·Granted Apr 25, 2000·12 cites·8 claims
- 1939US10812031B2Electronic device and method for adjusting gain of digital audio signal based on hearing recognition characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·15 claims
- 2034USD432853SMicrowave ovenDAEWOO ELECTRONICS CO LTD·Filed 1998·Granted Oct 31, 2000·2 cites·1 claims
- 2132US5982039ACompletely buried contact holesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Nov 9, 1999·2 cites·10 claims
- 2229US5950105ACompletely buried contact holes and methods of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Sep 7, 1999·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →