Inventor · disambiguated record
Byung Ho Kim
Also filed as: KIM BYUNG HO
25 granted patents·13 pending applications·34 citations·filing 2006–2024
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD22DONGBU HITEK CO LTD4SAMSUNG ELECTRO MECH3KIM BYUNG-HO2OH GUN-SEOK2
Top patents by PatentIndex Score
38 records- 0193US10770416B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 8, 2020·10 cites·17 claims
- 0283US9811265B2Buffer memory devices, memory modules and solid state disks with non-uniform memory device connectionsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·19 claims
- 0381US10078198B2Photographing apparatus for automatically determining a focus area and a control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 18, 2018·4 cites·18 claims
- 0478US10008398B2Substrate thinning apparatus, method of thinning substrate by using the same, and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 26, 2018·2 cites·18 claims
- 0574US10515916B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 0671US11011485B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 18, 2021·1 cites·20 claims
- 0770US10824580B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 3, 2020·1 cites·17 claims
- 0870US10491826B2Method for obtaining panning shot image and electronic device supporting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 26, 2019·1 cites·17 claims
- 0970US10389951B2Method for processing image and electronic device supporting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 20, 2019·1 cites·20 claims
- 1068US10622273B2Semiconductor package with improved flatness of an insulating layer formed on patternsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·1 cites·11 claims
- 1166US11476215B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 18, 2022·0 cites·20 claims
- 1264US10090835B2On-die termination circuit, a memory device including the on-die termination circuit, and a memory system including the memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 2, 2018·1 cites·9 claims
- 1362US2025192019A1Semiconductor package including interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1461US2025062240A1Semiconductor package with improved structural stabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1560US2025192013A1Wiring substrate and semiconductor package including a substrate wiring patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1659US2025192018A1Semiconductor package including interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1759US2010125493A1Common Purchase System and Method Having Circular Membership System for Congratulation and CondolenceKIM BYUNG-HO·Filed 2009·Application pending·0 cites
- 1859US2025006696A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1958US10095411B2Controllers including separate input-output circuits for mapping table and buffer memory, solid state drives including the controllers, and computing systems including the solid state drivesPARK JI WOON·Filed 2015·Granted Oct 9, 2018·1 cites·16 claims
- 2057US8841977B2Phase shifter for producing different phase shifts through different phase velocities in different linesJUNG MIN-SEOK·Filed 2009·Granted Sep 23, 2014·3 cites·13 claims
- 2154US2024222280A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2253US2009061625A1Lcd driver ic and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2008·Application pending·0 cites
- 2351US2024071895A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2451US2015114688A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2549US8418532B2Steam generator for sodium cooled fast reactor, heat transfer tubes thereof, and leak detection unit for heat transfer tube thereofNAM HO-YUN·Filed 2009·Granted Apr 16, 2013·2 cites·4 claims
- 2648US2020167844A1Membership-based digital mutual cooperation system and methodKIM BYUNG HO·Filed 2019·Application pending·0 cites
- 2747US10157868B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·0 cites·11 claims
- 2847US7713830B2Method of forming poly pattern in R-string of LCD drive IC and structure of the sameDONGBU HITEK CO LTD·Filed 2008·Granted May 11, 2010·0 cites·17 claims
- 2945US7595254B2Method of manufacturing a semiconductor deviceDONGBU HITEK CO LTD·Filed 2006·Granted Sep 29, 2009·0 cites·9 claims
- 3045US7589011B2Semiconductor device and method of forming intermetal dielectric layerDONGBU HITEK CO LTD·Filed 2006·Granted Sep 15, 2009·0 cites·11 claims
- 3144US10402620B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·21 claims
- 3243US12404249B2Heterocyclic derivatives and use thereofC&C RES LAB·Filed 2019·Granted Sep 2, 2025·0 cites·17 claims
- 3342US10872863B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 22, 2020·0 cites·20 claims
- 3441US10741448B2Method of singulating semiconductor die and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 3541US2019206756A1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 3638US8952865B2Antenna and transformer included in the sameOH GUN-SEOK·Filed 2010·Granted Feb 10, 2015·0 cites·6 claims
- 3737US8952866B2Dove tail device in an antennaOH GUN-SEOK·Filed 2010·Granted Feb 10, 2015·0 cites·5 claims
- 3837US2017351306A1Computer power supply device having fan control circuit for cooling standby power source unit in state in which computer is turned off, and operating methodHANMI MICRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →