Inventor · disambiguated record
Byeung Ho Kim
Also filed as: KIM BYEUNG G · KIM BYEUNG HO
4 granted patents·1 pending application·4 citations·filing 2005–2021
63Inventor score
Top patents by PatentIndex Score
5 records- 0163US11784100B2Method of manufacturing a molded flip chip package to facilitate electrical testingSK HYNIX INC·Filed 2021·Granted Oct 10, 2023·0 cites·10 claims
- 0258US8298865B2Method for manufacturing a substrate for a semiconductor packageJUNG YOUNG BERM·Filed 2012·Granted Oct 30, 2012·2 cites·11 claims
- 0355US11177184B2Method of manufacturing a flip chip package and an apparatus for testing flip chipsSK HYNIX INC·Filed 2019·Granted Nov 16, 2021·0 cites·12 claims
- 0453US8125086B2Substrate for semiconductor packageJUNG YOUNG BERM·Filed 2009·Granted Feb 28, 2012·2 cites·7 claims
- 0545US2007044495A1Monolithic air conditionerLG ELECTRONICS INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →