Inventor · disambiguated record
Byung Kun Kim
Also filed as: KIM BYUNG KUN
18 granted patents·6 pending applications·5 citations·filing 2013–2025
88Inventor score
Files withSAMSUNG ELECTRO MECH24
Top patents by PatentIndex Score
24 records- 0187US11569033B2Multilayer ceramic capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 0285US11715595B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 1, 2023·1 cites·19 claims
- 0380US2025191841A1Multilayer ceramic capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 0479US12334262B2Multilayer ceramic capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 17, 2025·0 cites·18 claims
- 0579US12230443B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 18, 2025·0 cites·6 claims
- 0679US2025239403A1Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 0778US12148570B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Nov 19, 2024·0 cites·16 claims
- 0878US11062845B2Multilayer ceramic capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 13, 2021·1 cites·13 claims
- 0978US10522285B2Multilayer ceramic capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Dec 31, 2019·1 cites·18 claims
- 1077US12488944B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Dec 2, 2025·0 cites·24 claims
- 1176US10475574B2Multilayer ceramic capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 12, 2019·1 cites·32 claims
- 1273US2024222019A1Capacitor component including indium and tin, and method of manufacturing the capacitor componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1372US12334263B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 17, 2025·0 cites·23 claims
- 1470US11967462B2Capacitor component including indium and tin, and method of manufacturing the capacitor componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Apr 23, 2024·0 cites·32 claims
- 1570US11664162B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 30, 2023·0 cites·14 claims
- 1669US12062492B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 13, 2024·0 cites·21 claims
- 1765US12057271B2Multilayered electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 6, 2024·0 cites·22 claims
- 1856US11715602B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 1, 2023·0 cites·23 claims
- 1951US11322302B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted May 3, 2022·0 cites·17 claims
- 2049US11488782B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 1, 2022·0 cites·8 claims
- 2149US2014377544A1Composite material, method for preparing thereof, and substrate using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2247US10580584B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 3, 2020·0 cites·19 claims
- 2346US2014377524A1Inorganic filler, insulation layer including the same, and substrate using insulation layerSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2435US2017094786A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →