Inventor · disambiguated record
Byongjoo Kim
Also filed as: KIM BYONGJOO
0 granted patents·5 pending applications·0 citations·filing 2014–2024
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0159US2025266399A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0253US2025066154A1Wire supply module and wire bonding machine including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0352US2025022837A1Wire bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0452US2025253302A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0536US2014339290A1Wire bonding method and semiconductor package manufactured using the sameHAN WON-GIL·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →