Inventor · disambiguated record
Byunghyun Kwak
Also filed as: KWAK BYUNGHYUN
1 granted patent·2 pending applications·10 citations·filing 2014–2023
32Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0181US9693455B1Integrated circuit packaging system with plated copper posts and method of manufacture thereofPARK SEONG WON·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
- 0245US2024105569A1Integrated package and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0328US2015318259A1Integrated circuit packaging system with no-reflow connection and method of manufacture thereofKIM KYUNGOE·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →