Inventor · disambiguated record
Byoungho Kwon
Also filed as: KWON BYOUNGHO
22 granted patents·12 pending applications·38 citations·filing 2008–2024
92Inventor score
Files withSAMSUNG ELECTRONICS CO LTD28HYUNDAI MOTOR CO LTD2KIM KI WOONG1KWON BYOUNGHO1PARK JONGHYUK1
Top patents by PatentIndex Score
34 records- 0192US10177160B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·16 cites·20 claims
- 0290US11322346B2Cleaning substrate method and method of processing substrate using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 3, 2022·3 cites·18 claims
- 0384US10716755B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 21, 2020·4 cites·20 claims
- 0482US10916554B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 9, 2021·2 cites·20 claims
- 0581US11964357B2Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 23, 2024·0 cites·11 claims
- 0681US10777560B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 15, 2020·1 cites·9 claims
- 0779US10096618B2Methods of fabricating three-dimensional semiconductor devicesKIM KI WOONG·Filed 2017·Granted Oct 9, 2018·3 cites·20 claims
- 0876US9677002B2Etching compositionSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 13, 2017·2 cites·6 claims
- 0972US11471996B2Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 18, 2022·0 cites·20 claims
- 1069US2024359286A1Chemical mechanical polishing apparatus and a method of polishing a substrate using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1168US10756092B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 25, 2020·0 cites·20 claims
- 1267US10566338B2Three-dimensional semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 18, 2020·1 cites·20 claims
- 1367US10504960B2Semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·1 cites·19 claims
- 1467US9909646B2Dynamic damper for drive shaftHYUNDAI MOTOR CO LTD·Filed 2015·Granted Mar 6, 2018·2 cites·10 claims
- 1566US9664250B2Variable frequency damper for drive shaft of vehicleHYUNDAI MOTOR CO LTD·Filed 2015·Granted May 30, 2017·1 cites·6 claims
- 1664US9165759B2Etching composition and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 20, 2015·1 cites·15 claims
- 1763US12482699B2Manufacturing method of semiconductor device including forming a recess filling patternSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 1862US11654458B2Substrate-cleaning apparatus having tiltable roll brushSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 1962US11590628B2Rotary body module and chemical mechanical polishing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 28, 2023·0 cites·15 claims
- 2062US10622364B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 14, 2020·0 cites·20 claims
- 2162US2025151426A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2261US2024258352A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2359US2025151441A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2458US10748906B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·11 claims
- 2558US2025142994A1Image sensor and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2658US2024332059A1Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2756US2024014068A1Semiconductor device including interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2854US2024147697A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2953US2024278383A1Chemical mechanical polishing apparatus and chemical mechanical polishing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3053US2024105745A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3149US8155358B2Method of simultaneously establishing the call connection among multi-users using virtual sound field and computer-readable recording medium for implementing the samePARK YOUNGJIN·Filed 2008·Granted Apr 10, 2012·1 cites·8 claims
- 3249US2016336327A1Method of fabricating semiconductor devicePARK JONGHYUK·Filed 2016·Application pending·0 cites
- 3337US2013183824A1Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3431US8268710B2Method for fabricating semiconductor devicesKWON BYOUNGHO·Filed 2010·Granted Sep 18, 2012·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →