Inventor · disambiguated record
Byung Woo Lee
Also filed as: LEE BYUNG-WOO
11 granted patents·4 pending applications·16 citations·filing 2010–2021
83Inventor score
Top patents by PatentIndex Score
15 records- 0192US10574794B1Systems and methods for interfacing networks regardless of communication schemeCOUPANG CORP·Filed 2019·Granted Feb 25, 2020·10 cites·17 claims
- 0276US11115503B2Systems and methods for interfacing networks regardless of communication schemeCOUPANG CORP·Filed 2020·Granted Sep 7, 2021·1 cites·18 claims
- 0375US8354744B2Stacked semiconductor package having reduced heightSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 15, 2013·4 cites·20 claims
- 0464US11265399B2Systems and methods for interfacing networks using a unified communication schemeCOUPANG CORP·Filed 2021·Granted Mar 1, 2022·0 cites·14 claims
- 0562US11493804B2Reflective diffusing lens and light emitting module comprising the sameMOLEX LLC·Filed 2021·Granted Nov 8, 2022·0 cites·9 claims
- 0662US11150513B2Reflective diffusing lens and light emitting module comprising the sameMOLEX LLC·Filed 2020·Granted Oct 19, 2021·0 cites·18 claims
- 0761US10931795B2Systems and methods for interfacing networks using a unified communication schemeCOUPANG CORP·Filed 2020·Granted Feb 23, 2021·0 cites·16 claims
- 0861US10582019B1Systems and methods for interfacing networks using a unified communication schemeCOUPANG CORP·Filed 2019·Granted Mar 3, 2020·0 cites·17 claims
- 0953US9607950B2Package substrate and semiconductor package including the sameLEE BYUNG WOO·Filed 2014·Granted Mar 28, 2017·1 cites·15 claims
- 1043US2024023351A1Perovskite solar cell module and manufacturing method for sameUNITEST INC·Filed 2021·Application pending·0 cites
- 1142US2014124910A1Semiconductor package and method of forming the sameLEE BYUNG-WOO·Filed 2013·Application pending·0 cites
- 1239US11026065B2Server and electronic device for transmitting and receiving information related to beaconSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 1, 2021·0 cites·11 claims
- 1337US2016211236A1Semiconductor package and method of forming the sameLEE BYUNG-WOO·Filed 2016·Application pending·0 cites
- 1437US2014143987A1Unit and zipper device for blocking harmful insectsLEE BYUNG-WOO·Filed 2012·Application pending·0 cites
- 1530US10871288B2Sealed plasma melting furnace for treating low- and intermediate-level radioactive wasteTRIPL CO LTD·Filed 2017·Granted Dec 22, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →