Inventor · disambiguated record
Byungsu Lee
Also filed as: LEE Byungsu
2 granted patents·1 pending application·7 citations·filing 2017–2019
50Inventor score
Top patents by PatentIndex Score
3 records- 0181US10194521B2Heat dissipation apparatus and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 29, 2019·6 cites·20 claims
- 0262US11225721B2Thin film etchant composition and method of forming metal pattern by using the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Jan 18, 2022·1 cites·19 claims
- 0346US2017344999A1Payment method and electronic device using loop antennasSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →