Inventor · disambiguated record
Byeong-Duck Lee
Also filed as: LEE BYEONG-DUCK
6 granted patents·363 citations·filing 1996–2017
86Inventor score
Top patents by PatentIndex Score
6 records- 0195US5821615ASemiconductor chip package having clip-type outlead and fabrication method of sameLG SEMICON CO LTD·Filed 1996·Granted Oct 13, 1998·263 cites·13 claims
- 0280US6242798B1Stacked bottom lead package in semiconductor devicesHYUNDAI ELECTRONICS IND·Filed 2000·Granted Jun 5, 2001·27 cites·14 claims
- 0370US6516516B1Semiconductor chip package having clip-type outlead and fabrication method of sameHYUNDAI ELECTRONICS IND·Filed 1998·Granted Feb 11, 2003·36 cites·17 claims
- 0467US6030858AStacked bottom lead package in semiconductor devices and fabricating method thereofLG SEMICON CO LTD·Filed 1997·Granted Feb 29, 2000·30 cites·7 claims
- 0536US6091135ALead frame with pre-mold paddle for a semiconductor chip packageLG SEMICON CO LTD·Filed 1997·Granted Jul 18, 2000·7 cites·13 claims
- 0632US10672961B2Light-emitting element package having lead frame with connection portionLG INNOTEK CO LTD·Filed 2017·Granted Jun 2, 2020·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →