Inventor · disambiguated record
Byoung-Gug Min
Also filed as: MIN BYOUNG-GUG
5 granted patents·1 pending application·10 citations·filing 2017–2024
72Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0185US10177096B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·5 cites·20 claims
- 0280US10410974B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·3 cites·19 claims
- 0368US11296037B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 5, 2022·1 cites·18 claims
- 0465US11011473B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 18, 2021·1 cites·17 claims
- 0562US11862571B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 0657US2025210547A1Semiconductor package including an electromagnetic shield and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Byoung-Gug Min files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →