Inventor · disambiguated record
Byung Woong Moon
Also filed as: MOON BYUNG WOONG
6 granted patents·2 citations·filing 2016–2018
66Inventor score
Files withINKTEC CO LTD6
Top patents by PatentIndex Score
6 records- 0169US11089691B2Microcircuit forming method and etching fluid compositionINKTEC CO LTD·Filed 2018·Granted Aug 10, 2021·2 cites·10 claims
- 0252US10383212B2Printed circuit board having EMI shielding function, method for manufacturing the same, and flat cable using the sameINKTEC CO LTD·Filed 2018·Granted Aug 13, 2019·0 cites·18 claims
- 0344US11453823B2Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution compositeINKTEC CO LTD·Filed 2018·Granted Sep 27, 2022·0 cites·31 claims
- 0438US11160171B2Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution compositionINKTEC CO LTD·Filed 2018·Granted Oct 26, 2021·0 cites·4 claims
- 0538US10887997B2Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCBINKTEC CO LTD·Filed 2016·Granted Jan 5, 2021·0 cites·7 claims
- 0633US11317514B2Method for forming circuits using seed layer and etchant composition for selective etching of seed layerINKTEC CO LTD·Filed 2018·Granted Apr 26, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →