Inventor · disambiguated record
Byeong Kuk Park
Also filed as: PARK BYEONG-KUK
1 granted patent·2 pending applications·1 citations·filing 2010–2024
16Inventor score
Top patents by PatentIndex Score
3 records- 0156US9508577B2Semiconductor manufacturing apparatuses comprising bonding headsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 29, 2016·1 cites·3 claims
- 0243US2025006534A1Semiconductor transfer deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0329US2011079361A1Apparatus for semiconductor die bondingPARK BYEONG-KUK·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →