Inventor · disambiguated record
Byunglyul Park
Also filed as: PARK BYUNGLYUL
7 granted patents·67 citations·filing 2002–2021
82Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0191US9799619B2Electronic device having a redistribution areaSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 24, 2017·9 cites·20 claims
- 0288US9806004B2Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping padSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 31, 2017·8 cites·19 claims
- 0379US6709970B1Method for creating a damascene interconnect using a two-step electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 23, 2004·43 cites·22 claims
- 0473US11121090B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·19 claims
- 0564US10020273B2Semiconductor devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 10, 2018·1 cites·20 claims
- 0657US11694965B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 0740USD859390SCover for an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 10, 2019·4 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →