Inventor · disambiguated record
Byeong Hak Park
Also filed as: PARK BYEONG HAK
2 granted patents·4 pending applications·1 citations·filing 2015–2023
30Inventor score
Top patents by PatentIndex Score
6 records- 0163US10670655B2Crack sensor including polymer for healing cracks and electronic device including the sameRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2018·Granted Jun 2, 2020·1 cites·12 claims
- 0250US2022364910A1Frequency-selective signal damper containing gelatin and chitosan hydrogel, and a device measuring signal using the sameRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2022·Application pending·0 cites
- 0348US11499898B2Anisotropic mechanical expansion substrate and crack-based pressure sensor using the anisotropic substrateRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2022·Granted Nov 15, 2022·0 cites·5 claims
- 0446US2022325768A1Zero poisson's ratio structure and a planar structure of zero poisson's ratio in which the structure is matrixed in a planeRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2022·Application pending·0 cites
- 0545US2023237209A1Zero poisson's ratio structure and three-dimensional array having zero poisson's ratio of zero poisson's ratio structuresRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2023·Application pending·0 cites
- 0630US2016175611A1Device for wirelessly stimulating body using lightUNIV SUNGKYUNKWAN RES & BUS·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →