Inventor · disambiguated record
Byung Jin Park
Also filed as: PARK BYUNG JIN
8 granted patents·4 pending applications·46 citations·filing 2006–2025
83Inventor score
Top patents by PatentIndex Score
12 records- 0195US11749138B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Sep 5, 2023·13 cites·20 claims
- 0295US11336983B1Receiver module having pressure equilibrium structureEM TECH CO LTD·Filed 2021·Granted May 17, 2022·6 cites·8 claims
- 0376US10996711B2Display device and electronic apparatus having the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Granted May 4, 2021·1 cites·19 claims
- 0475US8093721B2Flip chip semiconductor package and fabrication method thereofKANG IN-SOO·Filed 2007·Granted Jan 10, 2012·9 cites·15 claims
- 0573US8194127B2Method and apparatus for masking surveillance video images for privacy protectionKANG KYUN HO·Filed 2006·Granted Jun 5, 2012·16 cites·24 claims
- 0671US11782312B2Display apparatus and tiled display apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·4 claims
- 0764US11353745B2Display apparatus and tiled display apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·18 claims
- 0860US7817190B2Method and apparatus for processing an image exposed to backlightLG ELECTRONICS INC·Filed 2007·Granted Oct 19, 2010·1 cites·22 claims
- 0959US2025359416A1Display device and electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 1046US2011109558A1Button extension type letter input system for touch screenSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1142US2010032831A1Bump structure foe semiconductor deviceNEPES CORP·Filed 2008·Application pending·0 cites
- 1235US2012146216A1Semiconductor package and fabrication method thereofKANG IN SOO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →