Inventor · disambiguated record
Byung-Hyug Roh
Also filed as: ROH BYUNG-HYUG
8 granted patents·46 citations·filing 1996–2017
84Inventor score
Top patents by PatentIndex Score
8 records- 0187US9601465B2Chip-stacked semiconductor package and method of manufacturing the sameKANG UN-BYOUNG·Filed 2014·Granted Mar 21, 2017·8 cites·14 claims
- 0267US7888720B2Semiconductor device including conductive lines with fine line width and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 15, 2011·3 cites·6 claims
- 0361US8164119B2Semiconductor device including conductive lines with fine line width and method of fabricating the sameSEO HYEOUNG-WON·Filed 2011·Granted Apr 24, 2012·1 cites·2 claims
- 0458US6187676B1Integrated circuit insulated electrode forming methods using metal silicon nitride layers, and insulated electrodes so formedSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 13, 2001·17 cites·25 claims
- 0555US7629215B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 8, 2009·1 cites·25 claims
- 0649US9905538B2Chip-stacked semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·20 claims
- 0746US5705440AMethods of fabricating integrated circuit field effect transistors having reduced-area device isolation regionsSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jan 6, 1998·14 cites·13 claims
- 0829US6087233AForming trench isolators in semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 11, 2000·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →