Inventor · disambiguated record
C. Mark Johnson
Also filed as: JOHNSON C MARK
3 granted patents·81 citations·filing 2006–2021
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0194US7999369B2Power electronic package having two substrates with multiple semiconductor chips and electronic componentsDENSO CORP·Filed 2006·Granted Aug 16, 2011·62 cites·26 claims
- 0285US7557434B2Power electronic package having two substrates with multiple electronic componentsDENSO CORP·Filed 2006·Granted Jul 7, 2009·19 cites·36 claims
- 0349US11956914B2Sealed interface power module housingVIRGINIA TECH INTELLECTUAL PROPERTIES INC·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →