Inventor · disambiguated record
Candice H. Brown
Also filed as: BROWN CANDICE H
10 granted patents·1 pending application·878 citations·filing 1984–2015
93Inventor score
Top patents by PatentIndex Score
11 records- 0196US4729061AChip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefromADVANCED MICRO DEVICES INC·Filed 1986·Granted Mar 1, 1988·220 cites·8 claims
- 0295US4820976ATest fixture capable of electrically testing an integrated circuit die having a planar array of contactsADVANCED MICRO DEVICES INC·Filed 1987·Granted Apr 11, 1989·128 cites·13 claims
- 0395US4616406AProcess of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers thereinADVANCED MICRO DEVICES INC·Filed 1984·Granted Oct 14, 1986·116 cites·12 claims
- 0488US5126820AThermal expansion compensated metal lead frame for integrated circuit packageADVANCED MICRO DEVICES INC·Filed 1989·Granted Jun 30, 1992·81 cites·10 claims
- 0587US10229956B2High resolution low power consumption OLED display with extended lifetimeUNIVERSAL DISPLAY CORP·Filed 2015·Granted Mar 12, 2019·6 cites·21 claims
- 0686US4801999AIntegrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layersADVANCED MICRO DEVICES INC·Filed 1987·Granted Jan 31, 1989·76 cites·30 claims
- 0784US4931852AHigh thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit packageADVANCED MICRO DEVICES INC·Filed 1988·Granted Jun 5, 1990·68 cites·24 claims
- 0882US4918511AThermal expansion compensated metal lead frame for integrated circuit packageADVANCED MICRO DEVICES INC·Filed 1985·Granted Apr 17, 1990·62 cites·1 claims
- 0981US4640010AMethod of making a package utilizing a self-aligning photoexposure processADVANCED MICRO DEVICES INC·Filed 1985·Granted Feb 3, 1987·59 cites·15 claims
- 1076US5426266ADie bonding connector and methodPLANAR SYSTEMS INC·Filed 1993·Granted Jun 20, 1995·62 cites·6 claims
- 1135US2017287987A9High resolution low power consumption oled display with extended lifetimeUNIVERSAL DISPLAY CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →