Inventor · disambiguated record
Cathal Cassidy
Also filed as: CASSIDY CATHAL
9 granted patents·1 pending application·10 citations·filing 2012–2022
81Inventor score
Top patents by PatentIndex Score
10 records- 0187US9735101B2Semiconductor device with through-substrate via covered by a solder ballAMS AG·Filed 2016·Granted Aug 15, 2017·4 cites·6 claims
- 0280US9870988B2Method of producing a semiconductor device with through-substrate via covered by a solder ballAMS AG·Filed 2017·Granted Jan 16, 2018·2 cites·7 claims
- 0378US9553039B2Semiconductor device with through-substrate via covered by a solder ball and related method of productionAMS AG·Filed 2012·Granted Jan 24, 2017·3 cites·6 claims
- 0469US10828622B2Engineering high-performance palladium core magnesium oxide porous shell nanocatalysts via heterogeneous gas-phase synthesisOKINAWA INST SCIENCE & TECH SCHOOL CORP·Filed 2016·Granted Nov 10, 2020·1 cites·2 claims
- 0556US9773729B2Method of producing a semiconductor device with through-substrate via covered by a solder ballAMS AG·Filed 2016·Granted Sep 26, 2017·0 cites·5 claims
- 0655US2024429016A1Magnetic vector potential-based lensOKINAWA INST SCIENCE & TECH SCHOOL CORP·Filed 2022·Application pending·0 cites
- 0752US10332931B2Semiconductor device for wafer-scale integrationAMS AG·Filed 2017·Granted Jun 25, 2019·0 cites·5 claims
- 0852US9608035B2Method of wafer-scale integration of semiconductor devices and semiconductor deviceAMS AG·Filed 2013·Granted Mar 28, 2017·0 cites·5 claims
- 0942US9633842B2Metal induced nanocrystallization of amorphous semiconductor quantum dotsOKINAWA INST SCIENCE & TECH SCHOOL CORP·Filed 2014·Granted Apr 25, 2017·0 cites·11 claims
- 1041US9245843B2Semiconductor device with internal substrate contact and method of productionAMS AG·Filed 2013·Granted Jan 26, 2016·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →