Inventor · disambiguated record
Canfa Dai
Also filed as: Dai Canfa
1 granted patent·2 pending applications·0 citations·filing 2022–2025
13Inventor score
Files withFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD3
Top patents by PatentIndex Score
3 records- 0159US2025246548A1Three-dimensional memory device and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2025·Application pending·0 cites
- 0254US12300607B2Three-dimensional memory deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted May 13, 2025·0 cites·9 claims
- 0345US2024206166A1Three-dimensional memory device and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →