Inventor · disambiguated record
Caleb C. Han
Also filed as: HAN CALEB C
8 granted patents·3 pending applications·79 citations·filing 2012–2024
83Inventor score
Top patents by PatentIndex Score
11 records- 0197US9661411B1Integrated MEMS microphone and vibration sensorAPPLE INC·Filed 2016·Granted May 23, 2017·62 cites·20 claims
- 0294US11422104B2Exposed wire-bonding for sensing liquid and water in electronic devicesAPPLE INC·Filed 2020·Granted Aug 23, 2022·4 cites·15 claims
- 0393US11561144B1Wearable electronic device with fluid-based pressure sensingAPPLE INC·Filed 2019·Granted Jan 24, 2023·8 cites·20 claims
- 0475US9574959B2Various stress free sensor packages using wafer level supporting die and air gap techniqueAPPLE INC·Filed 2014·Granted Feb 21, 2017·3 cites·22 claims
- 0568US10041847B2Various stress free sensor packages using wafer level supporting die and air gap techniqueAPPLE INC·Filed 2016·Granted Aug 7, 2018·1 cites·22 claims
- 0660US2024389870A1Blood Pressure Monitoring System Including a Liquid Filled SensorAPPLE INC·Filed 2024·Application pending·0 cites
- 0759US8710636B1Lead frame array package with flip chip die attachHAN CALEB C·Filed 2013·Granted Apr 29, 2014·1 cites·9 claims
- 0855US2023384178A1Sensor Module Having an Intermediate Pedestal on Which One or More Die Are MountedAPPLE INC·Filed 2023·Application pending·0 cites
- 0952US12251204B2Blood pressure monitoring system including a liquid filled sensorAPPLE INC·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 1048US8969139B2Lead frame array package with flip chip die attachHAN CALEB C·Filed 2014·Granted Mar 3, 2015·0 cites·6 claims
- 1134US2013285259A1Method and system for wafer and strip level batch die attach assemblyHAN CALEB C·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →