Inventor · disambiguated record
Carl M. Roberts, Jr.
Also filed as: ROBERTS CARL M · ROBERTS JR CARL M
10 granted patents·2 pending applications·787 citations·filing 1988–2007
93Inventor score
Files withANALOG DEVICES INC11
Top patents by PatentIndex Score
12 records- 0197US6323550B1Package for sealing an integrated circuit dieANALOG DEVICES INC·Filed 1995·Granted Nov 27, 2001·349 cites·40 claims
- 0296US7357017B2Wafer level capped sensorANALOG DEVICES INC·Filed 2007·Granted Apr 15, 2008·42 cites·7 claims
- 0392US7508064B2Package for sealing an integrated circuit dieANALOG DEVICES INC·Filed 2005·Granted Mar 24, 2009·20 cites·17 claims
- 0492US7275424B2Wafer level capped sensorANALOG DEVICES INC·Filed 2005·Granted Oct 2, 2007·51 cites·13 claims
- 0590US7563632B2Methods for packaging and sealing an integrated circuit dieANALOG DEVICES INC·Filed 2007·Granted Jul 21, 2009·16 cites·25 claims
- 0689US6911727B1Package for sealing an integrated circuit dieANALOG DEVICES INC·Filed 2003·Granted Jun 28, 2005·46 cites·11 claims
- 0788US5362681AMethod for separating circuit dies from a waferANALOG DEVICES INC·Filed 1992·Granted Nov 8, 1994·164 cites·13 claims
- 0886US6621158B2Package for sealing an integrated circuit dieANALOG DEVICES INC·Filed 2001·Granted Sep 16, 2003·39 cites·32 claims
- 0965US4866505AAluminum-backed wafer and chipANALOG DEVICES INC·Filed 1988·Granted Sep 12, 1989·35 cites·7 claims
- 1060US5026667AProducing integrated circuit chips with reduced stress effectsANALOG DEVICES INC·Filed 1989·Granted Jun 25, 1991·25 cites·10 claims
- 1144US2008175425A1Microphone System with Silicon Microphone Secured to Package LidANALOG DEVICES INC·Filed 2007·Application pending·0 cites
- 1236US2005054133A1Wafer level capped sensorFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →