Inventor · disambiguated record
Casey Glenn Thielen
Also filed as: THIELEN CASEY · THIELEN CASEY G · THIELEN CASEY GLENN
4 granted patents·7 pending applications·0 citations·filing 2016–2024
52Inventor score
Top patents by PatentIndex Score
11 records- 0161US12317441B2Computer system and method of connecting rack-level devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 0253US2024311323A1Fanout connections on a high-performance computing deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0352US2024314930A1Computing system with connecting boardsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0452US2024315055A1Memory package expansionSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0550US11983135B2Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edgeINTEL CORP·Filed 2020·Granted May 14, 2024·0 cites·20 claims
- 0649US2025071903A1Method for efficiently connecting many high density smt pcb/backplane connectors for greatest pcb edge efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0749US2024311308A1Systems and methods for computing with multiple nodesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0844US2022092016A1Off-package high density, high bandwidth memory access using optical linksINTEL CORP·Filed 2020·Application pending·0 cites
- 0944US2022390694A1Thermal interface structures for optical communication devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 1040US10497687B2Configurable semiconductor packageINTEL CORP·Filed 2016·Granted Dec 3, 2019·0 cites·20 claims
- 1136US9955605B2Hardware interface with space-efficient cell patternINTEL CORP·Filed 2016·Granted Apr 24, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →