Inventor · disambiguated record
Carlo Zavattari
Also filed as: ZAVATTARI CARLO
6 granted patents·8 pending applications·139 citations·filing 1999–2023
84Inventor score
Files withZAVATTARI CARLO5MEMC ELECTRONIC MATERIALS3GLOBALWAFERS CO LTD2MEMC ELECTRONIC MATERIALS SPA2MEMC ELECTRONICS MATERIALS INC1
Top patents by PatentIndex Score
14 records- 0188US10315337B2Methods and system for controlling a surface profile of a waferSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2016·Granted Jun 11, 2019·5 cites·22 claims
- 0285US6941940B1Wire saw and process for slicing multiple semiconductor ingotsMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Sep 13, 2005·56 cites·12 claims
- 0381US7878883B2Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate controlMEMC ELECTRONICS MATERIALS INC·Filed 2007·Granted Feb 1, 2011·10 cites·17 claims
- 0481US7223344B2Method for treating an exhausted glycol-based slurryMEMC ELECTRONIC MATERIALS SPA·Filed 2001·Granted May 29, 2007·35 cites·31 claims
- 0574US6231628B1Method for the separation, regeneration and reuse of an exhausted glycol-based slurryMEMC ELECTRONIC MATERIALS·Filed 1999·Granted May 15, 2001·33 cites·20 claims
- 0659US2023390962A1Systems and methods for controlling surface profiles of wafers sliced in a wire sawGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 0752US2024218557A1Methods for producing off-orientation single crystal silicon wafersGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 0847US9156187B2Methods for mounting an ingot on a wire sawMEMC ELECTRONIC MATERIALS·Filed 2012·Granted Oct 13, 2015·0 cites·18 claims
- 0945US2013206163A1Methods and Systems For Removing Contaminants From A Wire Of A SawZAVATTARI CARLO·Filed 2012·Application pending·0 cites
- 1041US2013174828A1Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire SawMEMC ELECTRONIC MATERIALS SPA·Filed 2012·Application pending·0 cites
- 1138US2013139801A1Methods For Controlling Displacement Of Bearings In A Wire SawZAVATTARI CARLO·Filed 2011·Application pending·0 cites
- 1238US2013139800A1Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire SawZAVATTARI CARLO·Filed 2011·Application pending·0 cites
- 1338US2013144421A1Systems For Controlling Temperature Of Bearings In A Wire SawZAVATTARI CARLO·Filed 2011·Application pending·0 cites
- 1436US2013144420A1Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire SawZAVATTARI CARLO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →