Inventor · disambiguated record
Cecile Aulnette
Also filed as: AULNETTE CECILE · AULNETTE CÉCILE
29 granted patents·5 pending applications·380 citations·filing 2003–2017
97Inventor score
Files withSOITEC SILICON ON INSULATOR24DAVAL NICOLAS3COMMISSARIAT ENERGIE ATOMIQUE2AULNETTE CECILE1CHHAIMI NABIL1
Top patents by PatentIndex Score
34 records- 0195US6955971B2Semiconductor structure and methods for fabricating sameSOITEC SILICON ON INSULATOR·Filed 2003·Granted Oct 18, 2005·92 cites·39 claims
- 0292US6991956B2Methods for transferring a thin layer from a wafer having a buffer layerSOITEC SILICON ON INSULATOR·Filed 2005·Granted Jan 31, 2006·23 cites·23 claims
- 0391US7459374B2Method of manufacturing a semiconductor heterostructureSOITEC SILICON ON INSULATOR·Filed 2007·Granted Dec 2, 2008·19 cites·17 claims
- 0491US7407867B2Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrateSOITEC SILICON ON INSULATOR·Filed 2006·Granted Aug 5, 2008·19 cites·14 claims
- 0591US6991995B2Method of producing a semiconductor structure having at least one support substrate and an ultrathin layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2004·Granted Jan 31, 2006·54 cites·20 claims
- 0688US7256075B2Recycling of a wafer comprising a multi-layer structure after taking-off a thin layerSOITEC SILICON ON INSULATOR·Filed 2005·Granted Aug 14, 2007·20 cites·30 claims
- 0787US9954139B2Multiple transfer assembly processSOITEC SILICON ON INSULATOR·Filed 2014·Granted Apr 24, 2018·7 cites·13 claims
- 0887US8367521B2Manufacture of thin silicon-on-insulator (SOI) structuresSOITEC SILICON ON INSULATOR·Filed 2010·Granted Feb 5, 2013·8 cites·18 claims
- 0987US7446019B2Method of reducing roughness of a thick insulating layerSOITEC SILICON ON INSULATOR·Filed 2006·Granted Nov 4, 2008·10 cites·17 claims
- 1085US7232743B2Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating sameSOITEC SILICON ON INSULATOR·Filed 2005·Granted Jun 19, 2007·9 cites·25 claims
- 1183US7018910B2Transfer of a thin layer from a wafer comprising a buffer layerSOITEC SILICON ON INSULATOR·Filed 2003·Granted Mar 28, 2006·30 cites·27 claims
- 1276US7544976B2Semiconductor heterostructureSOITEC SILICON ON INSULATOR·Filed 2007·Granted Jun 9, 2009·5 cites·19 claims
- 1376US7375008B2Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereofSOITEC SILICON ON INSULATOR·Filed 2005·Granted May 20, 2008·6 cites·27 claims
- 1476US7008857B2Recycling a wafer comprising a buffer layer, after having separated a thin layer therefromSOITEC SILICON ON INSULATOR·Filed 2004·Granted Mar 7, 2006·16 cites·36 claims
- 1571US7602046B2Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereofSOITEC SILICON ON INSULATOR·Filed 2005·Granted Oct 13, 2009·4 cites·22 claims
- 1669US7572714B2Film taking-off methodSOITEC SILICON ON INSULATOR·Filed 2005·Granted Aug 11, 2009·4 cites·24 claims
- 1767US6995427B2Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating sameSOITEC SILICON ON INSULATOR·Filed 2004·Granted Feb 7, 2006·9 cites·31 claims
- 1865US6908774B2Method and apparatus for adjusting the thickness of a thin layer of semiconductor materialSOITEC SILICON ON INSULATOR·Filed 2003·Granted Jun 21, 2005·9 cites·25 claims
- 1964US7115481B2Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Oct 3, 2006·10 cites·21 claims
- 2063US7078353B2Indirect bonding with disappearance of bonding layerSOITEC SILICON ON INSULATOR·Filed 2004·Granted Jul 18, 2006·8 cites·21 claims
- 2162US8324075B2Methods for recycling substrates and fabricating laminated wafersAULNETTE CECILE·Filed 2008·Granted Dec 4, 2012·3 cites·19 claims
- 2262US7232488B2Method of fabrication of a substrate for an epitaxial growthSOITEC SILICON ON INSULATOR·Filed 2004·Granted Jun 19, 2007·10 cites·20 claims
- 2355US10361326B2Advanced CPV solar cell assembly processSOITEC SILICON ON INSULATOR·Filed 2014·Granted Jul 23, 2019·0 cites·26 claims
- 2454US2009325362A1Method of recycling an epitaxied donor waferCHHAIMI NABIL·Filed 2009·Application pending·0 cites
- 2553US8183128B2Method of reducing roughness of a thick insulating layerDAVAL NICOLAS·Filed 2008·Granted May 22, 2012·0 cites·21 claims
- 2652US7033905B2Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical meansSOITEC SILICON ON INSULATOR·Filed 2003·Granted Apr 25, 2006·5 cites·33 claims
- 2750US7378729B2Recycling a wafer comprising a buffer layer, after having separated a thin layer therefromSOITEC SILICON ON INSULATOR·Filed 2005·Granted May 27, 2008·0 cites·20 claims
- 2848US2011183493A1Process for manufacturing a structure comprising a germanium layer on a substrateSOITEC SILICON ON INSULATOR·Filed 2009·Application pending·0 cites
- 2944US2010167500A1Method of recycling an epitaxied donor waferS O TEC SILICON ON INSULATOR T·Filed 2010·Application pending·0 cites
- 3041US9177961B2Wafer with intrinsic semiconductor layerDAVAL NICOLAS·Filed 2012·Granted Nov 3, 2015·0 cites·17 claims
- 3141US9018678B2Method for forming a Ge on III/V-on-insulator structureDAVAL NICOLAS·Filed 2012·Granted Apr 28, 2015·0 cites·13 claims
- 3238US2004087042A1Method and apparatus for adjusting the thickness of a layer of semiconductor materialFiled 2003·Application pending·0 cites
- 3338US2005023610A1Semiconductor-on-insulator structure having high-temperature elastic constraintsFiled 2003·Application pending·0 cites
- 3436US11430910B2Engineered substrateSOITEC SILICON ON INSULATOR·Filed 2017·Granted Aug 30, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →