Inventor · disambiguated record
Christoph Bayer
Also filed as: BAYER CHRISTOPH · BAYER CHRISTOPH FRIEDRICH
5 granted patents·8 pending applications·4 citations·filing 2017–2025
65Inventor score
Top patents by PatentIndex Score
13 records- 0175US11404074B2Method for the classification of temporally sequential digital audio dataBOSCH GMBH ROBERT·Filed 2020·Granted Aug 2, 2022·2 cites·15 claims
- 0266US11296054B2Power converter module and method for production thereofFRAUNHOFER GES FORSCHUNG·Filed 2018·Granted Apr 5, 2022·2 cites·22 claims
- 0360US2025349619A1Method for Attaching Metallic Bodies to Thin Semiconductor Dies at Wafer LevelINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0455US2024304538A1Semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0555US2024162129A1Substrate arrangement and methods for producing a substrate arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0650US2023360984A1Semiconductor Package Comprising Structures Configured to Withstand a Change of the Volume of a Potting CompoundINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0746US11521899B2Method for increasing the electrical functionality, and/or service life, of power electronic modulesFRAUNHOFER GES FORSCHUNG·Filed 2021·Granted Dec 6, 2022·0 cites·9 claims
- 0843US11749533B2Method of manufacturing a power semiconductor component arrangement or a power semiconductor component housingFRAUNHOFER GES FORSCHUNG·Filed 2021·Granted Sep 5, 2023·0 cites·15 claims
- 0943US2021305197A1Method for connecting components during production of power electronic modules or assembliesFRAUNHOFER GES FORSCHUNG·Filed 2021·Application pending·0 cites
- 1041US2025273633A1Semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1141US2020024895A1Butt joint glazingSAINT GOBAIN·Filed 2017·Application pending·0 cites
- 1240US11477567B2Method and system for locating an acoustic source relative to a vehicleBOSCH GMBH ROBERT·Filed 2019·Granted Oct 18, 2022·0 cites·13 claims
- 1334US2018166413A1Electrically conductive bond between at least two electrical components at a carrier mounted with electronic and/or electrical devices, said bond being formed by a bond wireFRAUNHOFER GES FORSCHUNG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →