Inventor · disambiguated record
Christian Bergeron
Also filed as: BERGERON CHRISTIAN
6 granted patents·2 pending applications·72 citations·filing 1999–2020
81Inventor score
Top patents by PatentIndex Score
8 records- 0192US10784202B2High-density chip-to-chip interconnection with silicon bridgeIBM·Filed 2017·Granted Sep 22, 2020·33 cites·15 claims
- 0268US6333491B1Apparatus and method for non-destructive, low stress removal of soldered electronic componentsIBM·Filed 2000·Granted Dec 25, 2001·13 cites·10 claims
- 0361US6163014AApparatus and method for non-destructive, low stress removal of soldered electronic componentsIBM·Filed 1999·Granted Dec 19, 2000·20 cites·11 claims
- 0457US6320163B2Apparatus and method for non-destructive, low stress removal of soldered electronic componentsIBM·Filed 2000·Granted Nov 20, 2001·6 cites·4 claims
- 0549US11139269B2Mixed under bump metallurgy (UBM) interconnect bridge structureIBM·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 0647US2019350307A1Metatarsal guard for safety footwear and method for manufacturing the sameCHAUSSURES REGENCE INC·Filed 2019·Application pending·0 cites
- 0739US2020315294A1Sock-lined footwear and associated manufacturing methodCHAUSSURES REGENCE INC·Filed 2020·Application pending·0 cites
- 0836US8514386B2Technique for verifying the microstructure of lead-free interconnects in semiconductor assembliesBERGERON CHRISTIAN·Filed 2011·Granted Aug 20, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →