Inventor · disambiguated record
Christopher David Bohn
Also filed as: BOHN CHRISTOPHER · BOHN CHRISTOPHER DAVID
3 granted patents·2 pending applications·0 citations·filing 2020–2025
46Inventor score
Top patents by PatentIndex Score
5 records- 0173US12255047B1Embedded high-z marker material and process for alignment of multilevel ebeam lithographyHRL LAB LLC·Filed 2023·Granted Mar 18, 2025·0 cites·4 claims
- 0262US2025301576A1High aspect ratio vias filled with liquid metal fillSAMTEC INC·Filed 2025·Application pending·0 cites
- 0360US11823864B1Embedded high-Z marker material and process for alignment of multilevel ebeam lithographyHRL LAB LLC·Filed 2020·Granted Nov 21, 2023·0 cites·14 claims
- 0454US12336112B2High aspect ratio vias filled with liquid metal fillSAMTEC INC·Filed 2022·Granted Jun 17, 2025·0 cites·18 claims
- 0542US2025087569A1Filling materials and methods of filling viasSAMTEC INC·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Christopher David Bohn files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →