Inventor · disambiguated record
Christo Bojkov
Also filed as: BOJKOV CHRISTO · BOJKOV CHRISTO P · BOJKOV CHRISTO PAVEL
20 granted patents·8 pending applications·260 citations·filing 1996–2024
94Inventor score
Top patents by PatentIndex Score
28 records- 0194US11626340B2Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)QORVO US INC·Filed 2019·Granted Apr 11, 2023·9 cites·22 claims
- 0294US8035226B1Wafer level package integrated circuit incorporating solder balls containing an organic plastic-coreMAXIM INTEGRATED PRODUCTS·Filed 2008·Granted Oct 11, 2011·57 cites·24 claims
- 0387US6979647B2Method for chemical etch control of noble metals in the presence of less noble metalsTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 27, 2005·54 cites·17 claims
- 0486US7005752B2Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesionTEXAS INSTRUMENTS INC·Filed 2003·Granted Feb 28, 2006·42 cites·22 claims
- 0584US7271030B2Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesionTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 18, 2007·12 cites·6 claims
- 0680US7262126B2Sealing and protecting integrated circuit bonding padsTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 28, 2007·11 cites·16 claims
- 0778US10832984B2Environmental protection for wafer level and package level applicationsQORVO US INC·Filed 2020·Granted Nov 10, 2020·1 cites·8 claims
- 0874US11929300B2Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)QORVO US INC·Filed 2023·Granted Mar 12, 2024·0 cites·18 claims
- 0970US10651103B2Environmental protection for wafer level and package level applicationsQORVO US INC·Filed 2017·Granted May 12, 2020·1 cites·19 claims
- 1066US6504311B1Cold-cathode cathodoluminescent lampSI DIAMOND TECHN INC·Filed 1996·Granted Jan 7, 2003·19 cites·15 claims
- 1165US6927493B2Sealing and protecting integrated circuit bonding padsTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 9, 2005·13 cites·14 claims
- 1259US5973452ADisplaySI DIAMOND TECHN INC·Filed 1997·Granted Oct 26, 1999·13 cites·18 claims
- 1359US5906721AComposition and method for preparing phosphor films exhibiting decreased coulombic agingSI DIAMOND TECHN INC·Filed 1997·Granted May 25, 1999·11 cites·13 claims
- 1452US12002866B2Radio frequency devices with photo-imageable polymers and related methodsQORVO US INC·Filed 2021·Granted Jun 4, 2024·0 cites·24 claims
- 1552US2024413098A1Multilayer moisture repelling films for front end fet applicationsQORVO US INC·Filed 2024·Application pending·0 cites
- 1651US5947783AMethod of forming a cathode assembly comprising a diamond layerSI DIAMOND TECHN INC·Filed 1997·Granted Sep 7, 1999·8 cites·5 claims
- 1751US2023178467A1Die attach systemQORVO US INC·Filed 2022·Application pending·0 cites
- 1850US11877505B2Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devicesQORVO US INC·Filed 2021·Granted Jan 16, 2024·0 cites·16 claims
- 1950US10855240B2Structures for spatial power-combining devicesQORVO US INC·Filed 2018·Granted Dec 1, 2020·0 cites·22 claims
- 2050US6084338ACathode assembly with diamond particles and layerSI DIAMOND TECHN INC·Filed 1999·Granted Jul 4, 2000·7 cites·6 claims
- 2150US2024258197A1Methods and assemblies for cooling semiconductor devices using carbon allotropesQORVO US INC·Filed 2023·Application pending·0 cites
- 2247US2023343662A1Molding compound thermal enhancement utilizing graphene or graphite materialsQORVO US INC·Filed 2023·Application pending·0 cites
- 2345US11791312B2MMICs with backside interconnects for fanout-style packagingQORVO US INC·Filed 2019·Granted Oct 17, 2023·0 cites·14 claims
- 2443US2004140219A1System and method for pulse current platingTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 2539US2004157450A1Waferlevel method for direct bumping on copper pads in integrated circuitsFiled 2004·Application pending·0 cites
- 2637US2003116845A1Waferlevel method for direct bumping on copper pads in integrated circuitsFiled 2002·Application pending·0 cites
- 2734US5853554AComposition and method for preparing phosphor films exhibiting decreased coulombic agingSI DIAMOND TECHN INC·Filed 1996·Granted Dec 29, 1998·2 cites·11 claims
- 2834US2003107137A1Micromechanical device contact terminals free of particle generationFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →