Inventor · disambiguated record
Christina M. Boyko
Also filed as: BOYKO CHRISTINA M · BOYKO CHRISTINA MARIE · MARKOVICH VOYA RISTA
22 granted patents·1,022 citations·filing 1990–2003
97Inventor score
Files withIBM22
Top patents by PatentIndex Score
22 records- 0197US6931726B2Method of making and interconnect structureIBM·Filed 2003·Granted Aug 23, 2005·91 cites·3 claims
- 0297US6775907B1Process for manufacturing a printed wiring boardIBM·Filed 2000·Granted Aug 17, 2004·140 cites·10 claims
- 0392US6015520AMethod for filling holes in printed wiring boardsIBM·Filed 1997·Granted Jan 18, 2000·84 cites·27 claims
- 0489US5450290APrinted circuit board with aligned connections and method of making sameIBM·Filed 1994·Granted Sep 12, 1995·153 cites·22 claims
- 0588US6214525B1Printed circuit board with circuitized cavity and methods of producing sameIBM·Filed 1999·Granted Apr 10, 2001·105 cites·38 claims
- 0688US6212769B1Process for manufacturing a printed wiring boardIBM·Filed 1999·Granted Apr 10, 2001·66 cites·12 claims
- 0785US6121069AInterconnect structure for joining a chip to a circuit cardIBM·Filed 1999·Granted Sep 19, 2000·66 cites·12 claims
- 0883US5571593AVia fill compositions for direct attach of devices and methods for applying sameIBM·Filed 1995·Granted Nov 5, 1996·53 cites·7 claims
- 0977US5766670AVia fill compositions for direct attach of devices and methods for applying sameIBM·Filed 1993·Granted Jun 16, 1998·39 cites·3 claims
- 1076US5953623ABall limiting metal mask and tin enrichment of high melting point solder for low temperature interconnectionIBM·Filed 1997·Granted Sep 14, 1999·43 cites·20 claims
- 1176US5784782AMethod for fabricating printed circuit boards with cavitiesIBM·Filed 1996·Granted Jul 28, 1998·44 cites·18 claims
- 1269US6030693AMethod for producing multi-layer circuit board and resulting article of manufactureIBM·Filed 1998·Granted Feb 29, 2000·23 cites·2 claims
- 1366US6066386APrinted circuit board with cavity for circuitizationIBM·Filed 1998·Granted May 23, 2000·27 cites·9 claims
- 1465US6660945B2Interconnect structure and method of making sameIBM·Filed 2001·Granted Dec 9, 2003·9 cites·7 claims
- 1564US6194024B1Via fill compositions for direct attach of devices and methods for applying sameIBM·Filed 1995·Granted Feb 27, 2001·26 cites·4 claims
- 1656US4960634AEpoxy composition of increased thermal conductivity and use thereofIBM·Filed 1990·Granted Oct 2, 1990·23 cites·15 claims
- 1747US5374338ASelective electroetch of copper and other metalsIBM·Filed 1993·Granted Dec 20, 1994·10 cites·10 claims
- 1846US5830374AMethod for producing multi-layer circuit board and resulting article of manufactureIBM·Filed 1996·Granted Nov 3, 1998·10 cites·13 claims
- 1941US6776852B2Process of removing holefill residue from a metallic surface of an electronic substrateIBM·Filed 2002·Granted Aug 17, 2004·0 cites·15 claims
- 2036US6547974B1Method of producing fine-line circuit boards using chemical polishingIBM·Filed 1995·Granted Apr 15, 2003·6 cites·9 claims
- 2136US6134772AVia fill compositions for direct attach of devices and methods of applying sameIBM·Filed 1998·Granted Oct 24, 2000·3 cites·8 claims
- 2228US5472735AMethod for forming electrical connection to the inner layers of a multilayer circuit boardIBM·Filed 1994·Granted Dec 5, 1995·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →