Inventor · disambiguated record
Christopher Cantaloube
Also filed as: CANTALOUBE CHRISTOPHER · CANTALOUBE CHRISTOPHER A
4 granted patents·1 pending application·4 citations·filing 2020–2023
63Inventor score
Technology areasH10W
Files withMICROSOFT TECHNOLOGY LICENSING LLC5
Top patents by PatentIndex Score
5 records- 0189US12069967B2Integrated circuit including two substrates with qubits disposed within one of the two substratesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted Aug 20, 2024·3 cites·20 claims
- 0273US11417819B2Forming a bumpless superconductor device by bonding two substrates via a dielectric layerMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2020·Granted Aug 16, 2022·1 cites·17 claims
- 0371US12315834B2Electroplated indium bump stacks for cryogenic electronicsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Granted May 27, 2025·0 cites·9 claims
- 0464US11862593B2Electroplated indium bump stacks for cryogenic electronicsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Jan 2, 2024·0 cites·11 claims
- 0546US2022344240A1Multilayer superconducting structures for cryogenic electronicsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →