Inventor · disambiguated record
Charles F. Carey
Also filed as: CAREY CHARLES F · CAREY CHARLES FRANCIS
9 granted patents·276 citations·filing 1990–2010
89Inventor score
Files withIBM9
Top patents by PatentIndex Score
9 records- 0190US5075965ALow temperature controlled collapse chip attach processIBM·Filed 1990·Granted Dec 31, 1991·166 cites·11 claims
- 0285US7119003B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2005·Granted Oct 10, 2006·14 cites·19 claims
- 0374US5672260AProcess for selective application of solder to circuit packagesIBM·Filed 1996·Granted Sep 30, 1997·37 cites·11 claims
- 0474US5597469AProcess for selective application of solder to circuit packagesIBM·Filed 1995·Granted Jan 28, 1997·37 cites·7 claims
- 0558US7674637B2Monitoring cool-down stress in a flip chip process using monitor solder bump structuresIBM·Filed 2007·Granted Mar 9, 2010·1 cites·12 claims
- 0653US6677522B1Package for electronic componentIBM·Filed 2002·Granted Jan 13, 2004·8 cites·20 claims
- 0752US5656139AElectroplating apparatusIBM·Filed 1996·Granted Aug 12, 1997·13 cites·6 claims
- 0849US7851911B2Semiconductor chip used in flip chip processIBM·Filed 2010·Granted Dec 14, 2010·0 cites·8 claims
- 0939US7067916B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2001·Granted Jun 27, 2006·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →