Inventor · disambiguated record
Chan Wah Chai
Also filed as: CHAI CHAN H · CHAI CHAN WAH
0 granted patents·5 pending applications·0 citations·filing 2004–2019
Top patents by PatentIndex Score
5 records- 0140US2018130769A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2017·Application pending·0 cites
- 0239US2018130768A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2017·Application pending·0 cites
- 0334US2019259731A1Substrate based fan-out wafer level packagingUNISEM M BERHAD·Filed 2019·Application pending·0 cites
- 0428US2018130720A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2016·Application pending·0 cites
- 0510US2006128209A1Lighted booster cablesCHAI CHAN H·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →