Inventor · disambiguated record
Chien-Pin Chan
Also filed as: CHAN CHIEN-PIN
9 granted patents·1 pending application·9 citations·filing 2010–2025
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0185US2025357145A1Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0284US8610270B2Semiconductor device and semiconductor assembly with lead-free solderLAI YI-JEN·Filed 2010·Granted Dec 17, 2013·8 cites·19 claims
- 0382US12431365B2Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0474US10741513B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·20 claims
- 0573US12033870B2Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 0669US11527504B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 0757US10163836B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 0853US9875979B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 23, 2018·0 cites·22 claims
- 0953US8952534B2Semiconductor device and semiconductor assembly with lead-free solderTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·0 cites·19 claims
- 1052US11417539B2Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →