Inventor · disambiguated record
Chingho Philip Chan
Also filed as: CHAN CHINGHO PHILIP
2 granted patents·30 citations·filing 2004–2004
61Inventor score
Technology areasH10W
Files withUNIV HONG KONG SCIENCE & TECHN2
Top patents by PatentIndex Score
2 records- 0170US7199036B2Under-bump metallization layers and electroplated solder bumping technology for flip-chipUNIV HONG KONG SCIENCE & TECHN·Filed 2004·Granted Apr 3, 2007·23 cites·28 claims
- 0251US7135355B2Stencil mask design method and under bump metallurgy for C4 solder bumpUNIV HONG KONG SCIENCE & TECHN·Filed 2004·Granted Nov 14, 2006·7 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →