Inventor · disambiguated record
Chung-Hao Chang
Also filed as: CHANG CHUNG-HAO
17 granted patents·13 pending applications·28 citations·filing 2009–2025
89Inventor score
Files withCHANG CHUNG-HAO12TAIWAN SEMICONDUCTOR MFG CO LTD9YEH YUN-CHAO3LEGO STONE CO LTD2OBI PHARMA INC2
Top patents by PatentIndex Score
30 records- 0188US10470517B2Method of making moisture-permeable waterproof shoeCHANG CHUNG HAO·Filed 2018·Granted Nov 12, 2019·5 cites·11 claims
- 0286US10881165B2Zipper-free moisture-permeable waterproof high-top shoeCHANG CHUNG HAO·Filed 2019·Granted Jan 5, 2021·12 cites·9 claims
- 0385US10101662B2Developing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·3 cites·20 claims
- 0482US9733568B2Tool and method of developingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·4 cites·19 claims
- 0576US10627718B2Developing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·1 cites·20 claims
- 0675US2025244679A1Method of manufacturing semiconductor devices using a photomaskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0771US12287581B2Method of manufacturing semiconductor devices using a photomaskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 29, 2025·0 cites·20 claims
- 0870US11150558B2Developing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·20 claims
- 0967US2025163202A1Polyurethane-based midsole composition and shoe midsole made therefromLEGO STONE CO LTD·Filed 2024·Application pending·0 cites
- 1066US11752204B2Vaccines with higher carbohydrate antigen density and novel saponin adjuvantOBI PHARMA INC·Filed 2019·Granted Sep 12, 2023·0 cites·5 claims
- 1162US9442391B2Overlay sampling methodologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·2 cites·20 claims
- 1255US10517936B2Vaccines with higher carbohydrate antigen density and novel saponin adjuvantOBI PHARMA INC·Filed 2014·Granted Dec 31, 2019·0 cites·16 claims
- 1355US9583050B2Display apparatus and backlight driving moduleFITIPOWER INTEGRATED TECH INC·Filed 2015·Granted Feb 28, 2017·1 cites·16 claims
- 1452US2011077337A1Method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layersYEH YUN-CHAO·Filed 2009·Application pending·0 cites
- 1552US2011073798A1High thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layersYEH YUN-CHAO·Filed 2009·Application pending·0 cites
- 1651US11081365B2Treatment to interface between metal film and BARC or photoresistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
- 1750US12317950B2Torsion-resistant three-density high rigidity midsoleLEGO STONE CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·5 claims
- 1850US11786014B2Method for making moisture-permeable waterproof shoe having integrally formed upperCHANG CHUNG HAO·Filed 2021·Granted Oct 17, 2023·0 cites·8 claims
- 1949US11445780B2Double structure comfortable moisture-permeable waterproof shoeCHANG CHUNG HAO·Filed 2019·Granted Sep 20, 2022·0 cites·12 claims
- 2049US11140944B2Multi-style moisture-permeable waterproof shoeCHANG CHUNG HAO·Filed 2019·Granted Oct 12, 2021·0 cites·10 claims
- 2148US2020405013A1Multi-style comfortable shoeCHANG CHUNG HAO·Filed 2019·Application pending·0 cites
- 2244US2022192318A1Moisture-permeable waterproof shoeCHANG CHUNG HAO·Filed 2021·Application pending·0 cites
- 2343US2022338597A1Shoe having integrally formed upperCHANG CHUNG HAO·Filed 2021·Application pending·0 cites
- 2442US11127583B2Method of treating semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 2542US2013251469A1Double-sided metal of drilling entry boardYEH YUN-CHAO·Filed 2012·Application pending·0 cites
- 2642US2010321521A1Method of automatic white-balance calibrationCHANG CHUNG-HAO·Filed 2009·Application pending·0 cites
- 2738US2013078453A1Drilling entry board for printed circuit boardCHANG CHUNG-HAO·Filed 2012·Application pending·0 cites
- 2838US2012129414A1Thermosetting resin composition and prepreg or laminate using the sameCHANG CHUNG-HAO·Filed 2010·Application pending·0 cites
- 2936US2012095132A1Halogen- and phosphorus-free thermosetting resin compositionCHANG CHUNG-HAO·Filed 2010·Application pending·0 cites
- 3035US2014008590A1High heat resistant, low elastic modulus and fire resistant resin and its compoundsUNIPLUS ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →