Inventor · disambiguated record
Cheng-Kai Chang
Also filed as: CHANG CHENG · CHANG CHENG-KAI
11 granted patents·8 pending applications·94 citations·filing 1997–2025
84Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD12ADVANCED SEMICONDUCTOR ENG3OREAL2IND TECH RES INST1SILICONWAR E PR ECISION IND CO LT D1
Top patents by PatentIndex Score
19 records- 0193US11861497B2System and method for image processing using deep neural networksOREAL·Filed 2021·Granted Jan 2, 2024·5 cites·26 claims
- 0277US6041322AMethod and apparatus for processing data in a neural networkIND TECH RES INST·Filed 1997·Granted Mar 21, 2000·87 cites·7 claims
- 0374US12362263B2Electronic package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·6 claims
- 0474US2025309060A1Electronic package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0572US11216988B2System and method for image processing using deep neural networksOREAL·Filed 2018·Granted Jan 4, 2022·2 cites·29 claims
- 0659US2025087635A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0756US2025096213A1Optical package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0855US11398429B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 0955US2025266393A1Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1053US12002737B2Electronic package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jun 4, 2024·0 cites·7 claims
- 1152US11195812B2Method for fabricating an encapsulated electronic package using a supporting plateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·10 claims
- 1251US2024266335A1Electronic package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1351US2024203897A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1451US2024203896A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1550US11143549B2Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic dieSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·14 claims
- 1646US11114412B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 1740US11443994B2Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic packageSILICONWAR E PR ECISION IND CO LT D·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 1838US10431535B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·16 claims
- 1935US2018096967A1Electronic package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →