Inventor · disambiguated record
Chi-Hao Chang
Also filed as: CHANG CHI-HAO
33 granted patents·70 pending applications·40 citations·filing 2000–2025
94Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO72DOW SILICONES CORP10TAIWAN SEMICONDUCTOR MFG CO LTD7CHANG CHI-HAO2SEA SONIC ELECTRONICS CO LTD2
Top patents by PatentIndex Score
103 records- 0195US12237419B2Gate structures in transistor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 25, 2025·2 cites·20 claims
- 0293US11553612B2Foldable hinge for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jan 10, 2023·9 cites·16 claims
- 0391US10234905B2Hinge for foldable componentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Mar 19, 2019·13 cites·14 claims
- 0488US11892728B2Display with piezo material to alter a distance between a light source and an aperture layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Feb 6, 2024·2 cites·13 claims
- 0587US11401992B2Energy dampeners for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 2, 2022·1 cites·17 claims
- 0686US11490532B2Hinge assembliesHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Nov 1, 2022·4 cites·16 claims
- 0781US12181743B2Display with piezo material changing position of light source relative aperture layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 0880US12509618B2Thermal interface materialsDOW GLOBAL TECHNOLOGIES LLC·Filed 2022·Granted Dec 30, 2025·0 cites·10 claims
- 0976US2025311281A1Dielectric layers for semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1074US11808316B2Energy dampeners for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 1168US11939677B2Coated metal alloy substrate with at least one chamfered edge and process for production thereofHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Mar 26, 2024·0 cites·15 claims
- 1268US11502389B2Antenna windows in carbon fiber enclosuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 15, 2022·1 cites·18 claims
- 1368US2025151317A1Gate structures in transistor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1466US11009728B2Screen privacy devices with alternating polymer-dispersed liquid crystal bandsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted May 18, 2021·1 cites·15 claims
- 1566US10537939B2Method of manufacturing a honeycomb structure for an electronic deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jan 21, 2020·1 cites·7 claims
- 1665US2025299872A1Integrated magnetic componentSEA SONIC ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1765US2025202023A1Battery module with polyorganosiloxane foam barrierDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 1865US2025368784A1Organopolysiloxane composition with expanded perliteDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 1965US2025215176A1Organopolysiloxane foam with ceramic microspheresDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 2064US2025361372A1Organopolysiloxane foam with expanded perliteDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 2163US11402703B2Arrays of electrodes to control pixel contrast at display devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 2, 2022·0 cites·15 claims
- 2263US2025215226A1Organopolysiloxane composition withy ceramic microspheresDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 2363US2025026918A1Conductive silicone composition containing carboxylic acid-functional polyorganosiloxane thixotropic agentsDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 2462US2024010797A1Filled silicone composition containing succinic anhydride functional siloxane thixotropic agentsDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 2560US2025140687A1Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2659US12431043B2Heat spreading substrate for a displayHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Sep 30, 2025·0 cites·22 claims
- 2759US10533113B2Sol-gel hybrid coating composition, coating process and composite coating layersHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jan 14, 2020·0 cites·19 claims
- 2859US2025026113A1Laminate barrier with silicone foam layer defining voids containing endothermic materialDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 2959US2025042139A1Laminate barrier with ceramic or aerogel layer defining voids containing endothermic materialDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 3058US12211924B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 3157US12420534B2Aerogel polysiloxane layer laminate structureDOW SILICONES CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 3257US12339714B2Housings for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Jun 24, 2025·0 cites·18 claims
- 3357US2022137680A1Covers for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3457US2024223052A1Manufacturing method of magnetic assembly windingSEA SONIC ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3556US12324302B2Dual plate OLET displaysHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Jun 3, 2025·0 cites·20 claims
- 3656US11920244B2Device housing with metallic lusterHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Mar 5, 2024·0 cites·13 claims
- 3756US8244207B2System and method for payment using a mobile electronic deviceCHANG CHI-HAO·Filed 2009·Granted Aug 14, 2012·0 cites·15 claims
- 3856US2022403528A1Coated metal alloy substrate and process for production thereofHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3956US2024150590A1Coated substrates for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 4056US2022016869A1Covers for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4155US11475805B2Switchable displays with movable pixel unitsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Oct 18, 2022·0 cites·13 claims
- 4255US10899050B2Insert-molded componentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jan 26, 2021·0 cites·17 claims
- 4355US2022162766A1Coated Metal Alloy Substrate with at least one Chamfered Edge and Process for Production ThereofHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4455US2022145488A1Multi-color electronic housingsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4554US10401911B2Ceramic housingHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Sep 3, 2019·0 cites·27 claims
- 4654US2024158943A1Covers for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 4754US2022147118A1Covers for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4853US2021394233A1Printed foam panels for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4953US2024055525A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 5053US2023211375A1Coated substrates for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
Showing the top 50 of 103 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →