Inventor · disambiguated record
Chun Hua Chang
Also filed as: CHANG CHUN-HUA
21 granted patents·6 pending applications·47 citations·filing 2005–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD18CHANG CHUN HUA3TAIWAN SEMICONDUCTOR MFG3CANDO CORP1CHEN JIANN-FU1
Top patents by PatentIndex Score
27 records- 0191US8895385B2Methods of forming semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·10 cites·20 claims
- 0290US8552485B2Semiconductor structure having metal-insulator-metal capacitor structureCHANG CHUN HUA·Filed 2011·Granted Oct 8, 2013·12 cites·8 claims
- 0390US8487410B2Through-silicon vias for semicondcutor substrate and method of manufactureYU CHEN-HUA·Filed 2011·Granted Jul 16, 2013·8 cites·9 claims
- 0481US12400989B2Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 0581US8878338B2Capacitor for interposers and methods of manufacture thereofCHANG CHUN HUA·Filed 2012·Granted Nov 4, 2014·4 cites·20 claims
- 0681US2025391797A1Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0779US2025349689A1Semiconductor device and method of forming redistribution structures of conductive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0877US11183399B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·2 cites·20 claims
- 0977US10784162B2Method of making a semiconductor component having through-silicon viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
- 1076US9660016B2Method of manufacturing a capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·2 cites·11 claims
- 1173US11545392B2Semiconductor component having through-silicon viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 1273US10153338B2Method of manufacturing a capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·1 cites·20 claims
- 1373US10115634B2Semiconductor component having through-silicon vias and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·1 cites·20 claims
- 1472US8890224B2Semiconductor structures having a metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 18, 2014·2 cites·20 claims
- 1570US11929340B2Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 1669US11101140B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·1 cites·20 claims
- 1768US9418923B2Semiconductor component having through-silicon vias and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·1 cites·7 claims
- 1868US8575725B2Through-silicon vias for semicondcutor substrate and method of manufactureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 5, 2013·1 cites·21 claims
- 1965US2023402359A1Semiconductor device and method of forming redistribution structures of conductive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2061US8765549B2Capacitor for interposers and methods of manufacture thereofCHANG CHUN HUA·Filed 2012·Granted Jul 1, 2014·1 cites·18 claims
- 2153US2025139346A1Integrated circuit layout shapesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2252US10262939B2Configurable routing for packaging applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 16, 2019·0 cites·20 claims
- 2352US9530730B2Configurable routing for packaging applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 27, 2016·0 cites·16 claims
- 2450US10050103B2Method of forming semiconductor structures including metal insulator metal capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·0 cites·20 claims
- 2550US9666660B2Semiconductor structures including metal insulator metal capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 30, 2017·0 cites·20 claims
- 2629US2016070397A1Touch panel moduleCANDO CORP·Filed 2015·Application pending·0 cites
- 2729US2007141822A1Multi-step anneal methodCHEN JIANN-FU·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →